芯片大会解码中国芯片突围路径，助力光子产业挺进全球“决赛圈 Chip Conference Unveils China’s Roadmap for Semiconductor Innovation

Press/Media: Research / Knowledge Transfer › Research / Knowledge Transfer

Period	18 Oct 2025

Media coverage

Title	芯片大会解码中国芯片突围路径，助力光子产业挺进全球“决赛圈 Chip Conference Unveils China’s Roadmap for Semiconductor Innovation
Degree of recognition	Local
Media name/outlet	China Daily
Media type	Online
Country/Territory	Hong Kong, China
Date	18/10/25
URL	https://sz.chinadaily.com.cn/a/202510/18/WS68f33d5da310c4deea5ecfa6.html
Persons	Xin YAO