No photo of Liangliang LI

View Scopus Profile

LI Liangliang, Prof.

  • 8 Castle Peak Road, Tuen Mun

    Hong Kong

Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
20052025

Research activity per year

Filter
Conference paper (refereed)

Search results

  • 2017

    Pb-free silver pastes with SnO-B2O3 glass frits for crystalline silicon solar cells

    JIANG, J., LI, C., HE, Y., WEI, J. & LI, L., 19 Sept 2017, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. WANG, C., TIAN, Y. & YE, T. (eds.). IEEE, p. 44-49 6 p. 8046404

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

  • 2016

    Firing and contact resistivity of Ag2O-aided Pb-free silver paste for crystalline silicon solar cells

    JIAO, R., WU, T., ZHANG, B. & LI, L., 2016, Materials and Technologies for Energy Supply and Environmental Engineering. HAN, Y., WU, Y., FAN, R., LIU, X., LI, G. & PAN, F. (eds.). Trans Tech Publications Ltd, p. 123-130 8 p. (Materials Science Forum; vol. 847).

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    1 Citation (Scopus)

  • Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound

    YANG, D., CAI, J., WANG, Q., LI, J., HU, Y. & LI, L., 1 Dec 2016, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. IEEE, 7764519

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    9 Citations (Scopus)
  • 2015

    Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

    YANG, D., YANG, G., CAI, J., WANG, Q., LI, J., HU, Y. & LI, L., 2015, Proceedings: 16th International Conference on Electronic Packaging Technology, ICEPT 2015 第十六届电子封装技术国际会议. HE, H., BI, K. & ZHU, W. (eds.). IEEE, p. 439-446 8 p. 7236622

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Referred Conference Paper › peer-review

    5 Citations (Scopus)

  • Tunable high-frequency properties of Co-Ni ferromagnetic nanowires through composition modulation

    LEI, Y. & LI, L., 14 Jul 2015, 2015 IEEE International Magnetics Conference, INTERMAG 2015. IEEE, 7156656

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

  • 2014

    Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

    YANG, D., YANG, G., CAI, J., WANG, Q., HU, Y., LI, J. & LI, L., 13 Oct 2014, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. BI, K., TIAN, Z. & XU, Z. (eds.). IEEE, p. 239-242 4 p. 6922645

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    3 Citations (Scopus)
  • 2013

    Wettability of Sn-Bi and Sn-Ag-Cu lead-free solder pastes on electroplated Co-P films

    YANG, D., LU, N. & LI, L., 2013, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. IEEE, p. 1686-1691 6 p. 6575800. (Proceedings - Electronic Components and Technology Conference).

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    9 Citations (Scopus)
  • 2012

    Silver-based thermal interface materials with low thermal resistance

    YU, H., ZHANG, R., LI, L., MAO, X. & DU, H., 2012, ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, p. 410-413 4 p. 6474646

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    12 Citations (Scopus)
  • 2011

    20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays

    LI, Y., CHEN, Z., LI, L. & CAI, J., 2011, APM 2011 Proceedings : 2011 International Symposium on Advanced Packaging Materials. IEEE, p. 94-98 5 p. 6105679. (Proceedings - International Symposium on Advanced Packaging Materials).

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    10 Citations (Scopus)

  • Synthesis and low-temperature sintering of tin-doped silver nanoparticles

    ZHANG, Y., YU, H. & LI, L., 2011, APM 2011 Proceedings : 2011 International Symposium on Advanced Packaging Materials. IEEE, p. 209-212 4 p. 6105702. (Proceedings - International Symposium on Advanced Packaging Materials).

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

  • Viscosity and thermal conductivity of alumina microball/epoxy composites

    YU, H., LI, L. & QI, L., 2011, ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, p. 387-390 4 p. 6066859

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    9 Citations (Scopus)
  • 2010

    Dielectric composite material with enhanced thermal conductivity used for electronic packaging

    YU, H., LI, L., KIDO, T. & XI, G., 2010, Proceedings : 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. IEEE, p. 258-262 5 p. 5582424

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    6 Citations (Scopus)

  • Low alkaline solution to deposit electroless Ni-Zn-P film on al pad

    TAI, F.-C., LIN, H.-M., DUH, J.-G. & LI, L.-L., 2010, Proceedings : 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. IEEE, p. 429-432 4 p. 5582872

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    1 Citation (Scopus)

  • Multi-pulse electrodeposition of soft magnetic thin film Co-P for embedded inductor application

    LI, Y., LI, L. & CAI, J., 2010, Proceedings : 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. IEEE, p. 220-224 5 p. 5582436

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    3 Citations (Scopus)

  • Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines

    WANG, B. & LI, L., 2010, Proceedings : 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. IEEE, p. 582-586 5 p. 5583796

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    2 Citations (Scopus)
  • 2009

    On-package magnetic materials for embedded inductor applications

    LI, L., LEE, D. W., HWANG, K. P., MIN, Y. & WANG, S. X., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. IEEE, p. 471-474 4 p. 5270707

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    4 Citations (Scopus)
  • 2006

    High frequency responses of granular magnetic material CoFeHfO and amorphous material CoZrTa

    LI, L., LEE, D., WANG, S. X., MAO, M., SCHNEIDER, T., BUBBER, R., HWANG, K. & MIN, Y., 2006, INTERMAG 2006 : IEEE International Magnetics Conference. IEEE, p. 54 1 p. 4261488

    Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

    2 Citations (Scopus)