Abstract
随着电路设计高频化，对挠性印制电路板的可靠性提出了更加严格的要求。高频信号快速有效地传递，需要优化使用基板材料，粘合剂，铜箔等材料的选择。本文对在高频条件下挠性印制电路板材料的性质进行了分析介绍，并提出了几点建议。
As circuit design tends to using high frequency, it takes more strict requirements for the reliability of flexible printed circuit board (FPC). Quickly and efficiently spreading of high-frequency needs to optimize the selection of materials such as substrate, adhesives, and copper foil. In this paper we discuss the material properties of FPC for high-frequency applications and present several suggestions.
As circuit design tends to using high frequency, it takes more strict requirements for the reliability of flexible printed circuit board (FPC). Quickly and efficiently spreading of high-frequency needs to optimize the selection of materials such as substrate, adhesives, and copper foil. In this paper we discuss the material properties of FPC for high-frequency applications and present several suggestions.
| Translated title of the contribution | Materials of Flexible Printed Circuit Board for High-Frequency Applications |
|---|---|
| Original language | Chinese (Simplified) |
| Pages (from-to) | 39-41, 56 |
| Number of pages | 4 |
| Journal | 印制电路信息 |
| Volume | 2014 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - Oct 2014 |
| Externally published | Yes |
Keywords
- 挠性印制电路板
- 高频信号 介质损耗
- 介质损耗
- 导体损耗
- Flexible Printed Circuit Board
- High-Frequency Signal
- Dielectric Loss
- Conductor Loss