Abstract
挠性印制电路板和刚挠结合板向多层超薄高密度方向变化的趋势，必然带动上游的材料、工艺、设备等的相应发展，并激发新技术的出现。本文讨论了当今挠性印制电路板和刚挠结合板在材料和技术方面的发展趋势，介绍了挠性印制电路板的一些有潜力的应用方向，对其今后发展的挑战和机遇进行了分析。
The development of flexible and rigid-flexible printed circuit has been following the trend of being more layers, thinner and higher density. This trend win lead to the development of corresponding materials, processing, equipments, and motivate new technologies. This paper discusses the development trends of materials and technologies for flexible and rigid-flexible printed circuit, and introduces some promising applications for flex and rigid-flex circuits, and discusses the opportunities and challenges of them.
The development of flexible and rigid-flexible printed circuit has been following the trend of being more layers, thinner and higher density. This trend win lead to the development of corresponding materials, processing, equipments, and motivate new technologies. This paper discusses the development trends of materials and technologies for flexible and rigid-flexible printed circuit, and introduces some promising applications for flex and rigid-flex circuits, and discusses the opportunities and challenges of them.
| Translated title of the contribution | Opportunities and challenges in the development of flexible Printed Circuit Board |
|---|---|
| Original language | Chinese (Simplified) |
| Pages (from-to) | 16-17, 22 |
| Number of pages | 3 |
| Journal | 印制电路信息 |
| Volume | 2014 |
| Issue number | 1 |
| Publication status | Published - Jan 2014 |
| Externally published | Yes |
Keywords
- 挠性印制电路板
- 刚挠结合板
- 高密度
- Flexible Printed Circuit Board
- Rigid-Flexible Circuit Board
- High Density