Abstract
文章简述了当下流行的有机涂覆 (OSP)、化学镀镍浸金 (ENIG)、化学镀镍镀钯浸金 (ENEPIG) 等表面处理技术的发展现状；并对浸银 (IAg)、浸锡 (ISn) 和直接浸金(DIG) 以及自组装单分子 (SAM) 等新工艺进行了简单讨论，并提出了一些降低工艺成本,改进技术,提高工艺可靠性的方法。
This paper describes the status and new developments of OSP, ENIG, ENEPIG and discusses the newer surfaces finishes process like immersion silver finish (IAg), immersion tin finish (ISn), direct immersion gold finish (DIG) and self-assembled monolayer finish (SAM). Some suggestions of cost controlling, technology improvements and enhancement of reliability are given.
This paper describes the status and new developments of OSP, ENIG, ENEPIG and discusses the newer surfaces finishes process like immersion silver finish (IAg), immersion tin finish (ISn), direct immersion gold finish (DIG) and self-assembled monolayer finish (SAM). Some suggestions of cost controlling, technology improvements and enhancement of reliability are given.
| Translated title of the contribution | New development of surface finishes |
|---|---|
| Original language | Chinese (Simplified) |
| Pages (from-to) | 18-22 |
| Number of pages | 5 |
| Journal | 印制电路信息 |
| Volume | 2014 |
| Issue number | 1 |
| Publication status | Published - Jan 2014 |
| Externally published | Yes |
Keywords
- 表面处理
- 化学镀镍/浸金
- 化学镀镍/镀钯/浸金
- 浸银
- 浸锡
- 直接浸金
- 自组装单分子层
- Surface Finish
- ENIG
- ENEPIG
- IAg
- ISn
- DIG
- SAM