Abstract
The Bauschinger effect in thin sputter-deposited Al and Cu films is studied by isothermally deforming the films alternately in tension and compression. Passivated films exhibit an unusual Bauschinger effect with reverse flow already occurring on unloading, while unpassivated films show little or no reverse flows when the film is fully unloaded.
Original language | English |
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Pages (from-to) | 177-182 |
Number of pages | 6 |
Journal | Scripta Materialia |
Volume | 53 |
Issue number | 2 |
Early online date | 25 Apr 2005 |
DOIs | |
Publication status | Published - Jul 2005 |
Externally published | Yes |
Funding
This research is funded by NSF (DMR-0133559 and DMR-0215902). The authors gratefully acknowledge John W. Hutchinson and Morton G. Gurtin for helpful discussion.
Keywords
- Bauschinger effect
- Compression test
- Dislocations
- Plastic deformation
- Thin films