Bauschinger effect in thin metal films

Y. XIANG, J. J. VLASSAK*

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

106 Citations (Scopus)

Abstract

The Bauschinger effect in thin sputter-deposited Al and Cu films is studied by isothermally deforming the films alternately in tension and compression. Passivated films exhibit an unusual Bauschinger effect with reverse flow already occurring on unloading, while unpassivated films show little or no reverse flows when the film is fully unloaded.

Original languageEnglish
Pages (from-to)177-182
Number of pages6
JournalScripta Materialia
Volume53
Issue number2
Early online date25 Apr 2005
DOIs
Publication statusPublished - Jul 2005
Externally publishedYes

Bibliographical note

Acknowledgments: This research is funded by NSF (DMR-0133559 and DMR-0215902). The authors gratefully acknowledge John W. Hutchinson and Morton G. Gurtin for helpful discussion.

Keywords

  • Bauschinger effect
  • Compression test
  • Dislocations
  • Plastic deformation
  • Thin films

Fingerprint

Dive into the research topics of 'Bauschinger effect in thin metal films'. Together they form a unique fingerprint.

Cite this