The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.
|Number of pages||12|
|Journal||IFAC Proceedings Volumes|
|Publication status||Published - Jul 2004|
|Event||7th IFAC Symposium on Dynamics and Control of Process Systems, DYCOPS 2004 - Cambridge, United States|
Duration: 5 Jul 2004 → 7 Jul 2004
Bibliographical noteFinancial support from National Science Foundation under CTS-9985074 and a Faculty Research Assignment grant from University of Texas is gratefully acknowledged.
- Electrical parameter control
- Fab-wide control
- Fault detection and classification
- Metrology data monitoring
- Run to run control
- Semiconductor manufacturing