Cooperative buckling of parallel nanowires on elastomeric substrates

Youlong CHEN, Liangliang ZHU, Yilun LIU, Xi CHEN

Research output: Book Chapters | Papers in Conference ProceedingsConference paper (refereed)Researchpeer-review

1 Citation (Scopus)

Abstract

The cooperative buckling behaviors of parallel nanowires on an elastomeric substrate are investigated based on a finite element framework. Under compression of the elastomeric substrate, an especial helical buckling mode of nanowires and buckling evolution with effective compressive strain are observed. It is revealed that typical buckling characteristics of two parallel nanowires strongly depend on the distance between them. When the distance is smaller than a critical value hS/2 (half of a representative buckling spacing of a single nanowire on an elastomeric substrate), with decreasing of the separation distance, the buckling spacing, displacement amplitudes and the ratio between the in-/out-of-plane amplitudes all increase significantly. For parallel nanowire assembles, when the nanowires are closely arrayed, the buckling spacing notably increases with the number of nanowires. This study contributes to controllable buckling of stiff elements on a soft substrate and may shed some light on the design and optimization of flexible electronics. © 2016 Taylor & Francis Group, London.
Original languageEnglish
Title of host publicationMaterial Science and Engineering: Proceedings of the 3rd Annual International Conference on Material Science and Engineering, ICMSE 2015
EditorsPing CHEN
PublisherCRC Press, Taylor & Francis Group
Pages271-275
Number of pages4
ISBN (Electronic)9780429225543
ISBN (Print)9781138029361
Publication statusPublished - 2016
Externally publishedYes
Event3rd Annual 2015 International Conference on Material Science and Engineering - Guangdong, China
Duration: 15 May 201517 May 2015

Conference

Conference3rd Annual 2015 International Conference on Material Science and Engineering
Country/TerritoryChina
CityGuangdong
Period15/05/1517/05/15

Bibliographical note

The authors acknowledge the support from the National Natural Science Foundation of China (11302163, 11172231 and 11372241), ARPA-E (DE-AR0000396) and AFOSR (FA9550-12-1-0159).

Keywords

  • Finite element simulation
  • Flexible electronics
  • Helical buckling
  • Nanowire assemblies

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