Abstract
Electrocodeposition of alumina nanoparticles and copper thin film on silicon wafers was performed. The volume fraction of the nanoparticle is about 5% and the size is about 50 nm. Comparison between the static tensile behaviors of specimens with and without nanoparticles reveals that the Young's modulus is significantly increased by incorporating nanoparticles into the copper film. However, the ultimate tensile strength of the nanocomposite (235 MPa) is slightly lower than that of the pure copper reference specimen (250 MPa). For the nanocomposite, the strain at failure is 7.8%, which is lower than that of the pure copper film (10.5%). Distinct microscale deformation mechanisms are observed: the main deformation mechanism of the pure copper film is slip followed by strain hardening, whereas for the nanocomposite, multistage failure behaviors are found due to the debonding at the nanoparticle/copper interface. Notched specimens were also tested and compared with the unnotched specimens. In addition, cyclic loading tests on the nanocomposite were conducted to show its hardening behavior. © Springer Science+Business Media, LLC 2007.
| Original language | English |
|---|---|
| Pages (from-to) | 5256-5263 |
| Number of pages | 7 |
| Journal | Journal of Materials Science |
| Volume | 42 |
| Issue number | 13 |
| DOIs | |
| Publication status | Published - 31 Jan 2007 |
| Externally published | Yes |
Bibliographical note
YXG appreciates Mr. Richard J. Harniman in the Nanoscience and Engineering Center, Columbia University for his valuable assistance in using the Hitachi S4700 scanning electron microscope. We also appreciate both the editor and the reviewers for providing valuable comments for modification on the paperFunding
Acknowledgments: This work was supported in part by MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR).