Abstract
The interfacial adhesion between electroplated Co-P films with various microstructures and substrate was thoroughly investigated by the nanoscratch method and transmission electron microscopy. The Co-P films with various P contents exhibited a completely amorphous structure, a nanocrystalline structure or a mixed structure. The experimental data show that the interfacial adhesion of the Co-P films strongly depends on their microstructure and the nanocrystalline film has stronger interfacial adhesion than the amorphous film. The intermetallic Co-Cu phase that forms at the interface between the nanocrystalline Co-P film and the substrate causes the increase of the adhesion strength. In addition, the first-principles calculation shows that the intense exchange coupling between Co(3d74s2) electrons and Cu(3d104s1) electrons results in the formation of the CoCu bond at the interface between the nanocrystalline Co-P film and the substrate and hence increases the interfacial adhesion strength. © 2012 Elsevier B.V.
| Original language | English |
|---|---|
| Pages (from-to) | 4822-4827 |
| Number of pages | 6 |
| Journal | Surface and Coatings Technology |
| Volume | 206 |
| Issue number | 23 |
| Early online date | 13 May 2012 |
| DOIs | |
| Publication status | Published - 15 Jul 2012 |
| Externally published | Yes |
Funding
This work was supported by the National Science and Technology Major Projects with the contract Nos. 2009ZX02038 and 2011ZX02601 , Tsinghua University Initiative Scientific Research Program , China Postdoctoral Science Foundation with the Grant No. 20110490348 , and the Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry. We thank the discussion with Dr. Wensheng Lai and Dr. Jiahao Li on first-principles calculation.
Keywords
- Co-P film
- First-principles calculation
- Interfacial adhesion
- Microstructure