Embedded passives

Pulugurtha Markondeya RAJ; Dok Won LEE; Liangliang LI; Shan Xiang WANG; Parthasarathi CHAKRABORTI; Himani SHARMA; Shubham JAIN; Rao TUMMALA

doi:10.1007/978-3-319-45098-8_13

Embedded passives

Pulugurtha Markondeya RAJ^*, Dok Won LEE, Liangliang LI, Shan Xiang WANG, Parthasarathi CHAKRABORTI, Himani SHARMA, Shubham JAIN, Rao TUMMALA

^*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Book Chapter › Research › peer-review

2 Citations (Scopus)

Abstract

Emerging portable smart devices with more functionality demands highperformance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems. This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.

Original language	English
Title of host publication	Materials for Advanced Packaging
Editors	Daniel LU, C. P. WONG
Publisher	Springer International Publishing
Pages	537-588
Number of pages	52
Edition	2
ISBN (Electronic)	9783319450988
ISBN (Print)	9783319450971
DOIs	https://doi.org/10.1007/978-3-319-45098-8_13
Publication status	Published - 2017
Externally published	Yes

Keywords

Capacitors
Embedded passives
Inductors
Magnetic core materials
Resistors
Thin-film passives

Access to Document

10.1007/978-3-319-45098-8_13

Cite this

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Embedded passives

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Keywords

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