Embedded passives

Pulugurtha Markondeya RAJ; Dok Won LEE; Liangliang LI; Shan Xiang WANG; Parthasarathi CHAKRABORTI; Himani SHARMA; Shubham JAIN; Rao TUMMALA

doi:10.1007/978-3-319-45098-8_13

Embedded passives

Pulugurtha Markondeya RAJ^*
, Dok Won LEE
, Liangliang LI
, Shan Xiang WANG
, Parthasarathi CHAKRABORTI
, Himani SHARMA
, Shubham JAIN
, Rao TUMMALA

^*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Book Chapter › Research › peer-review

2 Citations (Scopus)

Abstract

Emerging portable smart devices with more functionality demands highperformance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems. This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.

Original language	English
Title of host publication	Materials for Advanced Packaging
Editors	Daniel LU, C. P. WONG
Publisher	Springer International Publishing
Pages	537-588
Number of pages	52
Edition	2
ISBN (Electronic)	9783319450988
ISBN (Print)	9783319450971
DOIs	https://doi.org/10.1007/978-3-319-45098-8_13
Publication status	Published - 2017
Externally published	Yes

Bibliographical note

Publisher Copyright:
© Springer International Publishing Switzerland 2009, 2017.

Keywords

Capacitors
Embedded passives
Inductors
Magnetic core materials
Resistors
Thin-film passives

Access to Document

10.1007/978-3-319-45098-8_13

Cite this

@inbook{c85b8a60f8ac4c21b0948cf327224d20,

title = "Embedded passives",

abstract = "Emerging portable smart devices with more functionality demands highperformance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today{\textquoteright}s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems. This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.",

keywords = "Capacitors, Embedded passives, Inductors, Magnetic core materials, Resistors, Thin-film passives",

author = "RAJ, \{Pulugurtha Markondeya\} and LEE, \{Dok Won\} and Liangliang LI and WANG, \{Shan Xiang\} and Parthasarathi CHAKRABORTI and Himani SHARMA and Shubham JAIN and Rao TUMMALA",

note = "Publisher Copyright: {\textcopyright} Springer International Publishing Switzerland 2009, 2017.",

year = "2017",

doi = "10.1007/978-3-319-45098-8\_13",

language = "English",

isbn = "9783319450971",

pages = "537--588",

editor = "Daniel LU and WONG, \{C. P.\}",

booktitle = "Materials for Advanced Packaging",

publisher = "Springer International Publishing",

edition = "2",

}

TY - CHAP

T1 - Embedded passives

AU - RAJ, Pulugurtha Markondeya

AU - LEE, Dok Won

AU - LI, Liangliang

AU - WANG, Shan Xiang

AU - CHAKRABORTI, Parthasarathi

AU - SHARMA, Himani

AU - JAIN, Shubham

AU - TUMMALA, Rao

N1 - Publisher Copyright: © Springer International Publishing Switzerland 2009, 2017.

PY - 2017

Y1 - 2017

N2 - Emerging portable smart devices with more functionality demands highperformance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems. This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.

AB - Emerging portable smart devices with more functionality demands highperformance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems. This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.

KW - Capacitors

KW - Embedded passives

KW - Inductors

KW - Magnetic core materials

KW - Resistors

KW - Thin-film passives

UR - https://www.scopus.com/pages/publications/85018059906

U2 - 10.1007/978-3-319-45098-8_13

DO - 10.1007/978-3-319-45098-8_13

M3 - Book Chapter

AN - SCOPUS:85018059906

SN - 9783319450971

SP - 537

EP - 588

BT - Materials for Advanced Packaging

A2 - LU, Daniel

A2 - WONG, C. P.

PB - Springer International Publishing

ER -

Embedded passives

Abstract

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this