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Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material

  • Siyang LI*
  • , Donghua YANG
  • , Qing TAN
  • , Liangliang LI*
    • *Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

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