Evolution of thermal stress in a coating/substrate system during the cooling process of fabrication

  • Yan SONG
  • , Xin ZHUAN
  • , T. J. WANG*
  • , Xi CHEN
    • *Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

36 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Evolution of thermal stress in a coating/substrate system during the cooling process of fabrication'. Together they form a unique fingerprint.

Physics

Material Science

Engineering