Formation of Cu2ZnSnSe4 through direct selenization of metal oxides

Jian MAO, Shu ZHANG*, Xiaoli PENG, Jianfei ZHANG, Haitao ZHANG, Longyan GU, Yong XIANG

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

4 Citations (Scopus)

Abstract

This article describes a fabrication approach to Cu2ZnSnSe4 thin films through the direct selenization of precursor films of the metal oxide mixture with elemental selenium at 550 °C for 40 min. The resulting films exhibit a well compacted morphology composed of crystallites of a few micrometers and having reliable photoelectric response in photoelectrochemical determination, suggesting the potential of photovoltaic applications of the films fabricated by this method. To investigate the formation pathway of the Cu2ZnSnSe4 film in this direct selenization method, selenization reactions were carried out with individual Cu, Zn, and Sn oxides under the same conditions, and the results showed that the formation rate of Cu2ZnSnSe4 from a mixture of metal oxides is comparable with that of Cu2Se formation, but faster than those of ZnSe and SnSe2 formation. The facilitated selenization kinetics to form Cu2ZnSnSe4 may be attributed to the oxidation state change of Cu(II) to Cu(I) and Sn(II) to Sn(IV) and the formation of cubic ZnO phase during the preparation of the mixture of metal oxides.

Original languageEnglish
Pages (from-to)137-141
Number of pages5
JournalVacuum
Volume118
Early online date24 Jan 2015
DOIs
Publication statusPublished - Aug 2015
Externally publishedYes

Funding

The authors gratefully acknowledge the National Science Funds of China (Contract No. 51102038 and 51472044), and the Program for New Century Excellent Talents in University.

Keywords

  • CuZnSnSe
  • Formation pathway
  • Metal oxide
  • Selenization
  • Solar cell material
  • Thin film

Fingerprint

Dive into the research topics of 'Formation of Cu2ZnSnSe4 through direct selenization of metal oxides'. Together they form a unique fingerprint.

Cite this