High ductility of a metal film adherent on a polymer substrate

Yong XIANG; Teng LI; Zhigang SUO; Joost J. VLASSAK

doi:10.1063/1.2108110

High ductility of a metal film adherent on a polymer substrate

Yong XIANG, Teng LI, Zhigang SUO, Joost J. VLASSAK^*

^*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

289 Citations (Scopus)

Abstract

In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.

Original language	English
Article number	161910
Pages (from-to)	1-3
Number of pages	3
Journal	Applied Physics Letters
Volume	87
Issue number	16
Early online date	12 Oct 2005
DOIs	https://doi.org/10.1063/1.2108110
Publication status	Published - 17 Oct 2005
Externally published	Yes

Bibliographical note

This work was supported by the NSF (DMR-0133559) and by the MRSEC at Harvard University.

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10.1063/1.2108110

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abstract = "In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.",

author = "Yong XIANG and Teng LI and Zhigang SUO and VLASSAK, {Joost J.}",

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AU - XIANG, Yong

AU - LI, Teng

AU - SUO, Zhigang

AU - VLASSAK, Joost J.

N1 - This work was supported by the NSF (DMR-0133559) and by the MRSEC at Harvard University.

PY - 2005/10/17

Y1 - 2005/10/17

N2 - In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.

AB - In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.

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M3 - Journal Article (refereed)

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JO - Applied Physics Letters

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ER -

High ductility of a metal film adherent on a polymer substrate

Abstract

Bibliographical note

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