High temperature digital image correlation evaluation of in-situ failure mechanism: An experimental framework with application to C/SiC composites

W.G. MAO, J. CHEN, M.S. SI, R.F. ZHANG, Q.S. MA, D.N. FANG, X. CHEN

Research output: Journal PublicationsJournal Article (refereed)peer-review

27 Citations (Scopus)

Abstract

A high temperature digital image correlation (DIC) technique was developed, which was applied to study the in-situ fracture behavior of a carbon fibre reinforced silicon carbide matrix (C/SiC) composite. The displacement distribution and cracking information of the C/SiC single edge notched beam specimen can be monitored real-time, thanks to the improved DIC technique with special speckle patterns that can reach up to 1600 °C. The results showed that the brittle to ductile transition temperature of C/SiC composites is about 1300 °C. The new failure mechanisms of C/SiC composites at different experimental temperatures were further verified with the aid of X-ray diffraction and scanning electron microscope (SEM) techniques. In addition, the relationships between the fracture toughness, first-crack strength of C/SiC composites and environmental temperature were deduced. The proposed experimental method and testing results may shed some light on assessing the reliability and durability of C/SiC composites at high temperatures. © 2016 Elsevier B.V.
Original languageEnglish
Pages (from-to)26-34
Number of pages9
JournalMaterials Science and Engineering: A
Volume665
Early online date11 Apr 2016
DOIs
Publication statusPublished - 17 May 2016
Externally publishedYes

Bibliographical note

This work was supported by the National Natural Science Foundation of China (Grant nos. 11102177, 11272276, and 11572277), Hunan Provincial Natural Science Foundation of China (14JJ1020), the National Key Scientific Instrument and Equipment Development Project (2012YQ030075). XC acknowledges additional support from NSFC (11172231 and 11372241), ARPA-E (DE-AR0000396) and AFOSR (FA9550-12-1-0159).

Keywords

  • Brittle to ductile transition
  • C/SiC composites
  • Digital image correlation
  • High-temperature testing
  • Mechanical properties

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