IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Donghua YANG, Jian CAI, Qian WANG, Jingwei LI, Yang HU, Liangliang LI*

*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

32 Citations (Scopus)

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Material Science

Engineering