Influence of ultrasonic irradiation on the microstructure of Cu/Al2O3, CeO2 nanocomposite thin films during electrocodeposition

Dongyun LEE*, Yong X. GAN, Xi CHEN, Jeffrey W. KYSAR

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

43 Citations (Scopus)

Abstract

The agglomeration of nanoparticles during electrocodeposition of nanocomposite thin films is an unresolved issue. In this paper, the effects of ultrasonic irradiation on agglomeration during electrocodeposition of Cu-Al2O3 and Cu-CeO2 nanocomposite thin films on a silicon substrate are investigated. In addition, the effect of electrolyte concentration on agglomeration of nanoparticles is investigated. Irradiation by ultrasound during electrocodeposition yields smaller grain size, improved surface conditions, decreased agglomeration and higher volume fraction of nanosized inert particles within the nanocomposite thin films. © 2006 Elsevier B.V. All rights reserved.
Original languageEnglish
Pages (from-to)209-216
Number of pages8
JournalMaterials Science and Engineering: A
Volume447
Issue number1-2
Early online date11 Dec 2006
DOIs
Publication statusPublished - 25 Feb 2007
Externally publishedYes

Bibliographical note

Support from the National Science Foundation under the Faculty Early Career Development Program (CMS-0134226) and from the Academic Quality Fund of Columbia University are gratefully acknowledged. In addition, this work has used the shared experimental facilities that are supported primarily by the MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR).

Keywords

  • Electrocodeposition
  • Nanocomposite thin film
  • Ultrasonic irradiation

Fingerprint

Dive into the research topics of 'Influence of ultrasonic irradiation on the microstructure of Cu/Al2O3, CeO2 nanocomposite thin films during electrocodeposition'. Together they form a unique fingerprint.

Cite this