Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Donghua YANG, Guoshuai YANG, Jian CAI, Qian WANG, Jingwei LI, Yang HU, Liangliang LI

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Referred Conference Paper › peer-review

5 Citations (Scopus)

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