Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

Y. XIANG, X. CHEN, T.Y. TSUI, J.-I. JANG, J.J. VLASSAK*

*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

43 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique'. Together they form a unique fingerprint.

Material Science