Abstract
Polylactic acid (PLA)-based composites filled with 20 or 50 μm-diameter microdiamond are synthesized by hot pressing. Through improving the interface compatibility between the filler and the matrix enabled by octadecylamine (ODA) coating on the microdiamond particles, the maximum thermal conductivity of the composites is 2.22 Wm− 1 K− 1, which is a ~ 10-fold increase in comparison with that of pure PLA. According to the analysis on the glass transmission of the composites and the surface chemistry of the fillers using DSC, FI-IR, and Raman microscopy, it is found out that ODA is connected with the –OH group on the microdiamond surface through hydrogen bonding and an interfacial structure of PLA/ODA/microdiamond is formed. Thus, the interfacial thermal transport between PLA and microdiamond is significantly improved, leading to the enhancement of the thermal conductivity of the composites. Our work presents a simple method to modify the surface chemistry of microdiamond and to improve the interface compatibility between microdiamond and PLA. The microdiamond/PLA composites with large thermal conductivity are promising thermal management materials used for modern electronic products.
| Original language | English |
|---|---|
| Pages (from-to) | 161-167 |
| Number of pages | 7 |
| Journal | Diamond and Related Materials |
| Volume | 81 |
| Early online date | 14 Dec 2017 |
| DOIs | |
| Publication status | Published - Jan 2018 |
| Externally published | Yes |
Funding
This work was financially supported by the National Key Research and Development Program of China (Grant No. 2016YFA0201003), National Natural Science Foundation of China (Grant No. 51572149), National Basic Research Program of China (Grant No. 2013CB632504), and Fund of Key Laboratory of Advanced Materials of Ministry of Education (Grant No. 2017AML11).
Keywords
- Microdiamond
- PLA
- Thermal conductivity