Microdiamond/PLA composites with enhanced thermal conductivity through improving filler/matrix interface compatibility

Shiuan-Haur SU, Yajie HUANG, Shilian QU, Wei LIU, Rongxuan LIU, Liangliang LI*

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

26 Citations (Scopus)

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Chemical Engineering

Engineering

Material Science