Microdiamond/PLA composites with enhanced thermal conductivity through improving filler/matrix interface compatibility
- Shiuan-Haur SU
- , Yajie HUANG
- , Shilian QU
- , Wei LIU
- , Rongxuan LIU
- , Liangliang LI*
*Corresponding author for this work
Research output: Journal Publications › Journal Article (refereed) › peer-review
34
Link opens in a new tab
Citations
(Scopus)