@inproceedings{b79208b28919414fb04c743338965bbe,
title = "Modeling of OES data to estimate etch rate for etching equipment",
abstract = "Optical emission spectroscopy (OES) data for 495 wavelengths and wafer measurements (pre- and postoxide film thichness) from a commercial etch tool were collected for 18 oxide wafers to explore the feasibility of using OES as an in-situ sensor to estimate average oxide etch rate. A variable selection method is proposed based on the principle of partial least square (PLS) regression, which select several most informative wavelengths to build ordinary least square (OLS) regression models. Compared with the PLS models, it is found that OLS regression models based on selected wavelengths are more robust.",
keywords = "Etch rate, Optical emission spectroscopy, Regression model",
author = "Yi CHENG and MARKLE, {Richard J.} and Joe QIN and EDGAR, {Thomas F.} and GATTO, {Michael J.} and Chris NAUERT",
year = "1997",
month = oct,
doi = "10.1117/12.284627",
language = "English",
isbn = "9780819426451",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
pages = "108--118",
editor = "GHANBARI, {Abe } and TOPRAC, {Anthony J. }",
booktitle = "Proceedings of SPIE : Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III",
address = "United States",
note = "Microelectronic Manufacturing ; Conference date: 01-10-1997 Through 02-10-1997",
}