Novel technique for measuring the mechanical properties of porous materials by nanoindentation

X. CHEN; Y. XIANG; J.J. VLASSAK

doi:10.1557/jmr.2006.0088

Novel technique for measuring the mechanical properties of porous materials by nanoindentation

X. CHEN, Y. XIANG, J.J. VLASSAK

Research output: Journal Publications › Journal Article (refereed) › peer-review

99 Citations (Scopus)

Abstract

A new technique for measuring the elastic-plastic properties of porous thin films by means of nanoindentation is proposed. The effects of porosity on indentation hardness and modulus are investigated through finite element analyses based on the Gurson model for plastic deformation of ductile porous materials. Intrinsic mechanical properties of the thin film are obtained by eliminating both substrate and densification effects. The technique is applied to the special case of a porous, low-permittivity dielectric thin film. The results are in good agreement with those obtained independently using the plane-strain bulge test. © 2006 Materials Research Society.

Original language	English
Pages (from-to)	715-724
Number of pages	9
Journal	Journal of Materials Research
Volume	21
Issue number	3
DOIs	https://doi.org/10.1557/jmr.2006.0088
Publication status	Published - 2006
Externally published	Yes

Bibliographical note

The work of Xi Chen is supported by National Science Foundation CMS-0407743. Joost Vlassak and Yong Xiang acknowledge financial support from National Science Foundation DMR-0213805 and from the Semiconductor Research Corporation (Task ID 12920.010).

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10.1557/jmr.2006.0088

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title = "Novel technique for measuring the mechanical properties of porous materials by nanoindentation",

abstract = "A new technique for measuring the elastic-plastic properties of porous thin films by means of nanoindentation is proposed. The effects of porosity on indentation hardness and modulus are investigated through finite element analyses based on the Gurson model for plastic deformation of ductile porous materials. Intrinsic mechanical properties of the thin film are obtained by eliminating both substrate and densification effects. The technique is applied to the special case of a porous, low-permittivity dielectric thin film. The results are in good agreement with those obtained independently using the plane-strain bulge test. {\textcopyright} 2006 Materials Research Society.",

author = "X. CHEN and Y. XIANG and J.J. VLASSAK",

note = "The work of Xi Chen is supported by National Science Foundation CMS-0407743. Joost Vlassak and Yong Xiang acknowledge financial support from National Science Foundation DMR-0213805 and from the Semiconductor Research Corporation (Task ID 12920.010).",

year = "2006",

doi = "10.1557/jmr.2006.0088",

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AU - CHEN, X.

AU - XIANG, Y.

AU - VLASSAK, J.J.

N1 - The work of Xi Chen is supported by National Science Foundation CMS-0407743. Joost Vlassak and Yong Xiang acknowledge financial support from National Science Foundation DMR-0213805 and from the Semiconductor Research Corporation (Task ID 12920.010).

PY - 2006

Y1 - 2006

N2 - A new technique for measuring the elastic-plastic properties of porous thin films by means of nanoindentation is proposed. The effects of porosity on indentation hardness and modulus are investigated through finite element analyses based on the Gurson model for plastic deformation of ductile porous materials. Intrinsic mechanical properties of the thin film are obtained by eliminating both substrate and densification effects. The technique is applied to the special case of a porous, low-permittivity dielectric thin film. The results are in good agreement with those obtained independently using the plane-strain bulge test. © 2006 Materials Research Society.

AB - A new technique for measuring the elastic-plastic properties of porous thin films by means of nanoindentation is proposed. The effects of porosity on indentation hardness and modulus are investigated through finite element analyses based on the Gurson model for plastic deformation of ductile porous materials. Intrinsic mechanical properties of the thin film are obtained by eliminating both substrate and densification effects. The technique is applied to the special case of a porous, low-permittivity dielectric thin film. The results are in good agreement with those obtained independently using the plane-strain bulge test. © 2006 Materials Research Society.

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U2 - 10.1557/jmr.2006.0088

DO - 10.1557/jmr.2006.0088

M3 - Journal Article (refereed)

SN - 0884-2914

VL - 21

SP - 715

EP - 724

JO - Journal of Materials Research

JF - Journal of Materials Research

IS - 3

ER -

Novel technique for measuring the mechanical properties of porous materials by nanoindentation

Abstract

Bibliographical note

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