Abstract
Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package. © 2006 American Institute of Physics.
Original language | English |
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Article number | 08M301 |
Journal | Journal of Applied Physics |
Volume | 99 |
Issue number | 8 |
DOIs | |
Publication status | Published - 15 Apr 2006 |
Externally published | Yes |
Bibliographical note
We thank Dr. Arturas Vailionis for his great technical assistance with GIXS measurement at SSRL and Dok Won Lee for useful discussion.Funding
The work at Stanford University is supported in part by Intel Corp. and National Science Foundation.