Package compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering

Liangliang LI*, Shan X. WANG, Kyu-Pyung HWANG, Yongki MIN, Ming MAO, Thomas SCHNEIDER, Randhir BUBBER

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

7 Citations (Scopus)

Abstract

Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package. © 2006 American Institute of Physics.
Original languageEnglish
Article number08M301
JournalJournal of Applied Physics
Volume99
Issue number8
DOIs
Publication statusPublished - 15 Apr 2006
Externally publishedYes

Bibliographical note

We thank Dr. Arturas Vailionis for his great technical assistance with GIXS measurement at SSRL and Dok Won Lee for useful discussion. The work at Stanford University is supported in part by Intel Corp. and National Science Foundation.

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