Abstract
Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package. © 2006 American Institute of Physics.
Original language | English |
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Article number | 08M301 |
Journal | Journal of Applied Physics |
Volume | 99 |
Issue number | 8 |
DOIs | |
Publication status | Published - 15 Apr 2006 |
Externally published | Yes |