Plane-strain bulge test for nanocrystalline copper thin films

Xiaoding WEI*, Dongyun LEE, Sanghoon SHIM, Xi CHEN, Jeffrey W. KYSAR

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

33 Citations (Scopus)


Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10-5s-1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. © 2007 Acta Materialia Inc.
Original languageEnglish
Pages (from-to)541-544
Number of pages4
JournalScripta Materialia
Issue number6
Publication statusPublished - 2007
Externally publishedYes

Bibliographical note

Supports from NSF DMR-0650555, NSF CMMI-0500239, from the Academic Quality Fund of Columbia University, and NSF CMS-0407743, are gratefully acknowledged. In addition, this work was supported in part by the MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR). The authors also thank Prof. J. Vlassak and his research group for very helpful discussions.


  • Bulge test
  • Nanocrystalline materials
  • Thin films


Dive into the research topics of 'Plane-strain bulge test for nanocrystalline copper thin films'. Together they form a unique fingerprint.

Cite this