Plane-strain bulge test for nanocrystalline copper thin films

Xiaoding WEI; Dongyun LEE; Sanghoon SHIM; Xi CHEN; Jeffrey W. KYSAR

doi:10.1016/j.scriptamat.2007.05.012

Plane-strain bulge test for nanocrystalline copper thin films

Xiaoding WEI^*, Dongyun LEE, Sanghoon SHIM, Xi CHEN, Jeffrey W. KYSAR

^*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

33 Citations (Scopus)

Abstract

Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10^-5s^-1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. © 2007 Acta Materialia Inc.

Original language	English
Pages (from-to)	541-544
Number of pages	4
Journal	Scripta Materialia
Volume	57
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2007.05.012
Publication status	Published - 2007
Externally published	Yes

Bibliographical note

Supports from NSF DMR-0650555, NSF CMMI-0500239, from the Academic Quality Fund of Columbia University, and NSF CMS-0407743, are gratefully acknowledged. In addition, this work was supported in part by the MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR). The authors also thank Prof. J. Vlassak and his research group for very helpful discussions.

Keywords

Bulge test
Nanocrystalline materials
Thin films

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10.1016/j.scriptamat.2007.05.012

Cite this

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title = "Plane-strain bulge test for nanocrystalline copper thin films",

abstract = "Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10-5s-1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. {\textcopyright} 2007 Acta Materialia Inc.",

keywords = "Bulge test, Nanocrystalline materials, Thin films",

author = "Xiaoding WEI and Dongyun LEE and Sanghoon SHIM and Xi CHEN and KYSAR, {Jeffrey W.}",

note = "Supports from NSF DMR-0650555, NSF CMMI-0500239, from the Academic Quality Fund of Columbia University, and NSF CMS-0407743, are gratefully acknowledged. In addition, this work was supported in part by the MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR). The authors also thank Prof. J. Vlassak and his research group for very helpful discussions.",

year = "2007",

doi = "10.1016/j.scriptamat.2007.05.012",

language = "English",

volume = "57",

pages = "541--544",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Ltd",

number = "6",

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TY - JOUR

T1 - Plane-strain bulge test for nanocrystalline copper thin films

AU - WEI, Xiaoding

AU - LEE, Dongyun

AU - SHIM, Sanghoon

AU - CHEN, Xi

AU - KYSAR, Jeffrey W.

N1 - Supports from NSF DMR-0650555, NSF CMMI-0500239, from the Academic Quality Fund of Columbia University, and NSF CMS-0407743, are gratefully acknowledged. In addition, this work was supported in part by the MRSEC Program of the National Science Foundation under Award Number DMR-0213574 and by the New York State Office of Science, Technology and Academic Research (NYSTAR). The authors also thank Prof. J. Vlassak and his research group for very helpful discussions.

PY - 2007

Y1 - 2007

N2 - Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10-5s-1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. © 2007 Acta Materialia Inc.

AB - Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10-5s-1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. © 2007 Acta Materialia Inc.

KW - Bulge test

KW - Nanocrystalline materials

KW - Thin films

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U2 - 10.1016/j.scriptamat.2007.05.012

DO - 10.1016/j.scriptamat.2007.05.012

M3 - Journal Article (refereed)

SN - 1359-6462

VL - 57

SP - 541

EP - 544

JO - Scripta Materialia

JF - Scripta Materialia

IS - 6

ER -

Plane-strain bulge test for nanocrystalline copper thin films

Abstract

Bibliographical note

Keywords

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