Plane-strain bulge test for nanocrystalline copper thin films

Material Science

• Thin Films 100%
• Strain 100%
• Copper 100%
• Nanocrystalline 100%
• Mechanical Strength 50%
• Young's Modulus 50%
• Film Thickness 50%
• Plastic Deformation 50%
• Yield Stress 50%
• Strain Rate 50%
• Grain Growth 50%
• Grain Size 50%
• Deformation Mechanism 50%
• Dislocation Mechanism 50%

Physics

• Thin Films 100%
• Plane Strain 100%
• Copper 100%
• Modulus of Elasticity 50%
• Film Thickness 50%
• Plastic Deformation 50%
• Thermal Evaporation 50%
• Grain Boundaries 50%