Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

Donghua YANG; Guoshuai YANG; Jian CAI; Qian WANG; Yang HU; Jingwei LI; Liangliang LI

doi:10.1109/ICEPT.2014.6922645

Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

Donghua YANG^*, Guoshuai YANG, Jian CAI, Qian WANG, Yang HU, Jingwei LI, Liangliang LI

^*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

3 Citations (Scopus)

Abstract

In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages.

Original language	English
Title of host publication	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Editors	Keyun BI, Zhong TIAN, Ziqiang XU
Publisher	IEEE
Pages	239-242
Number of pages	4
ISBN (Electronic)	9781479947072
DOIs	https://doi.org/10.1109/ICEPT.2014.6922645
Publication status	Published - 13 Oct 2014
Externally published	Yes
Event	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 - Chengdu, China Duration: 12 Aug 2014 → 15 Aug 2014

Conference

Conference	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Country/Territory	China
City	Chengdu
Period	12/08/14 → 15/08/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

Keywords

Co-P
shear strength
Sn-Pb solder joints
surface finish
thermal cycling

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10.1109/ICEPT.2014.6922645

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@inproceedings{068063966df74813a32d22c63e964ed0,

title = "Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling",

abstract = "In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages.",

keywords = "Co-P, shear strength, Sn-Pb solder joints, surface finish, thermal cycling",

author = "Donghua YANG and Guoshuai YANG and Jian CAI and Qian WANG and Yang HU and Jingwei LI and Liangliang LI",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",

year = "2014",

month = oct,

day = "13",

doi = "10.1109/ICEPT.2014.6922645",

language = "English",

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editor = "Keyun BI and Zhong TIAN and Ziqiang XU",

booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",

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YANG, D, YANG, G, CAI, J, WANG, Q, HU, Y, LI, J & LI, L 2014, Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling. in K BI, Z TIAN & Z XU (eds), 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014., 6922645, IEEE, pp. 239-242, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China, 12/08/14. https://doi.org/10.1109/ICEPT.2014.6922645

Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling. / YANG, Donghua; YANG, Guoshuai; CAI, Jian et al.
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. ed. / Keyun BI; Zhong TIAN; Ziqiang XU. IEEE, 2014. p. 239-242 6922645.

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

TY - GEN

T1 - Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

AU - YANG, Donghua

AU - YANG, Guoshuai

AU - CAI, Jian

AU - WANG, Qian

AU - HU, Yang

AU - LI, Jingwei

AU - LI, Liangliang

PY - 2014/10/13

Y1 - 2014/10/13

N2 - In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages.

AB - In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages.

KW - Co-P

KW - shear strength

KW - Sn-Pb solder joints

KW - surface finish

KW - thermal cycling

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U2 - 10.1109/ICEPT.2014.6922645

DO - 10.1109/ICEPT.2014.6922645

M3 - Conference paper (refereed)

AN - SCOPUS:84908096415

SP - 239

EP - 242

BT - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

A2 - BI, Keyun

A2 - TIAN, Zhong

A2 - XU, Ziqiang

PB - IEEE

T2 - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

Y2 - 12 August 2014 through 15 August 2014

ER -

Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

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Keywords

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