Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

Donghua YANG*, Guoshuai YANG, Jian CAI, Qian WANG, Yang HU, Jingwei LI, Liangliang LI

*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

3 Citations (Scopus)

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