The semiconductor industry has started the technology transition from 200 mm to 300 mm wafers to improve manufacturing efficiency and reduce manufacturing cost. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300 mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context. Process and metrology data monitoring are discussed with an example. Missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.
Bibliographical noteFinancial support from National Science Foundation under CTS-9985074 and a Faculty Research Assignment grant from University of Texas is gratefully acknowledged, which enabled the first author for his sabbatical at AMD from 2001 to 2002, during which the fab-wide control framework was developed.
- Electrical parameter control
- Fab-wide control
- Fault detection and classification
- Metrology data monitoring
- Run-to-run control
- Semiconductor manufacturing