Abstract
The semiconductor industry has started the technology transition from 200 mm to 300 mm wafers to improve manufacturing efficiency and reduce manufacturing cost. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300 mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context. Process and metrology data monitoring are discussed with an example. Missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.
Original language | English |
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Pages (from-to) | 179-191 |
Number of pages | 13 |
Journal | Journal of Process Control |
Volume | 16 |
Issue number | 3 |
Early online date | 2 Aug 2005 |
DOIs | |
Publication status | Published - Mar 2006 |
Externally published | Yes |
Keywords
- Electrical parameter control
- Fab-wide control
- Fault detection and classification
- Metrology data monitoring
- Run-to-run control
- Semiconductor manufacturing