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Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound
Donghua YANG, Jian CAI, Qian WANG, Jingwei LI, Yang HU, Liangliang LI
Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review
9
Citations
(Scopus)