Silver-based thermal interface materials with low thermal resistance

Hui YU; Rui ZHANG; Liangliang LI; Xiaofei MAO; Hongda DU

doi:10.1109/ICEPT-HDP.2012.6474646

Silver-based thermal interface materials with low thermal resistance

Hui YU^*, Rui ZHANG, Liangliang LI, Xiaofei MAO, Hongda DU

^*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

11 Citations (Scopus)

Abstract

We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.

Original language	English
Title of host publication	ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
Publisher	IEEE
Pages	410-413
Number of pages	4
ISBN (Print)	9781467316804
DOIs	https://doi.org/10.1109/ICEPT-HDP.2012.6474646
Publication status	Published - 2012
Externally published	Yes
Event	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 - Guilin, China Duration: 13 Aug 2012 → 16 Aug 2012

Conference

Conference	2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Country/Territory	China
City	Guilin
Period	13/08/12 → 16/08/12

Keywords

silver nanoparticle
silver paste
thermal resistance

Access to Document

10.1109/ICEPT-HDP.2012.6474646

Cite this

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title = "Silver-based thermal interface materials with low thermal resistance",

abstract = "We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.",

keywords = "silver nanoparticle, silver paste, thermal resistance",

author = "Hui YU and Rui ZHANG and Liangliang LI and Xiaofei MAO and Hongda DU",

year = "2012",

doi = "10.1109/ICEPT-HDP.2012.6474646",

language = "English",

isbn = "9781467316804",

pages = "410--413",

booktitle = "ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging",

publisher = "IEEE",

note = "2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012 ; Conference date: 13-08-2012 Through 16-08-2012",

}

YU, H, ZHANG, R, LI, L, MAO, X & DU, H 2012, Silver-based thermal interface materials with low thermal resistance. in ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging., 6474646, IEEE, pp. 410-413, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, Guilin, China, 13/08/12. https://doi.org/10.1109/ICEPT-HDP.2012.6474646

Silver-based thermal interface materials with low thermal resistance. / YU, Hui; ZHANG, Rui; LI, Liangliang et al.
ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, 2012. p. 410-413 6474646.

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

TY - GEN

T1 - Silver-based thermal interface materials with low thermal resistance

AU - YU, Hui

AU - ZHANG, Rui

AU - LI, Liangliang

AU - MAO, Xiaofei

AU - DU, Hongda

PY - 2012

Y1 - 2012

N2 - We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.

AB - We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.

KW - silver nanoparticle

KW - silver paste

KW - thermal resistance

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U2 - 10.1109/ICEPT-HDP.2012.6474646

DO - 10.1109/ICEPT-HDP.2012.6474646

M3 - Conference paper (refereed)

AN - SCOPUS:84875459772

SN - 9781467316804

SP - 410

EP - 413

BT - ICEPT-HDP 2012 Proceedings : 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

PB - IEEE

T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012

Y2 - 13 August 2012 through 16 August 2012

ER -

Silver-based thermal interface materials with low thermal resistance

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Keywords

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