Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

Hui YU; Liangliang LI; Yujun ZHANG

doi:10.1016/j.scriptamat.2012.02.037

Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

Hui YU, Liangliang LI^*, Yujun ZHANG

^*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

136 Citations (Scopus)

Abstract

We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	931-934
Number of pages	4
Journal	Scripta Materialia
Volume	66
Issue number	11
Early online date	25 Feb 2012
DOIs	https://doi.org/10.1016/j.scriptamat.2012.02.037
Publication status	Published - Jun 2012
Externally published	Yes

Bibliographical note

This research at Tsinghua University was supported by the State Key Laboratory of New Ceramic and Fine Processing at Tsinghua University and Daikin Industries Ltd, Japan .

Keywords

Bonding
Sintering
Thermal conductivity
Thermal interface material

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10.1016/j.scriptamat.2012.02.037

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title = "Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications",

abstract = "We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. {\textcopyright} 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.",

keywords = "Bonding, Sintering, Thermal conductivity, Thermal interface material",

author = "Hui YU and Liangliang LI and Yujun ZHANG",

note = "This research at Tsinghua University was supported by the State Key Laboratory of New Ceramic and Fine Processing at Tsinghua University and Daikin Industries Ltd, Japan .",

year = "2012",

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doi = "10.1016/j.scriptamat.2012.02.037",

language = "English",

volume = "66",

pages = "931--934",

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TY - JOUR

T1 - Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

AU - YU, Hui

AU - LI, Liangliang

AU - ZHANG, Yujun

N1 - This research at Tsinghua University was supported by the State Key Laboratory of New Ceramic and Fine Processing at Tsinghua University and Daikin Industries Ltd, Japan .

PY - 2012/6

Y1 - 2012/6

N2 - We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

AB - We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

KW - Bonding

KW - Sintering

KW - Thermal conductivity

KW - Thermal interface material

UR - http://www.scopus.com/inward/record.url?scp=84862814240&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2012.02.037

DO - 10.1016/j.scriptamat.2012.02.037

M3 - Journal Article (refereed)

AN - SCOPUS:84862814240

SN - 1359-6462

VL - 66

SP - 931

EP - 934

JO - Scripta Materialia

JF - Scripta Materialia

IS - 11

ER -

Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

Abstract

Bibliographical note

Keywords

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