Abstract
The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young's modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young's modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.
| Original language | English |
|---|---|
| Article number | 491 |
| Pages (from-to) | 189-194 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 695 |
| DOIs | |
| Publication status | Published - 2001 |
| Externally published | Yes |
Funding
This investigation was supported by the Harvard MRSEC program and the Division of Engineering and Applied Sciences at Harvard University. The authors gratefully acknowledge M. T. Perez-Prado for providing the SEM and XRD data and T. Y. Tsui from Texas Instruments for supplying the Cu films.