The mechanical properties of electroplated Cu thin films measured by means of the bulge test technique

Y. XIANG, X. CHEN, J.J. VLASSAK

Research output: Book Chapters | Papers in Conference ProceedingsConference paper (refereed)Researchpeer-review

61 Citations (Scopus)

Abstract

The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young's modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young's modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.
Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
Pages189-194
Number of pages5
Volume695
Publication statusPublished - 2002
Externally publishedYes

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