The mechanical properties of electroplated Cu thin films measured by means of the bulge test technique

Yong XIANG, Xi CHEN, Joost J. VLASSAK

Research output: Journal PublicationsJournal Article (refereed)peer-review

62 Citations (Scopus)

Abstract

The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young's modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young's modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.
Original languageEnglish
Article number491
Pages (from-to)189-194
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume695
DOIs
Publication statusPublished - 2001
Externally publishedYes

Bibliographical note

This investigation was supported by the Harvard MRSEC program and the Division of Engineering and Applied Sciences at Harvard University. The authors gratefully acknowledge M. T. Perez-Prado for providing the SEM and XRD data and T. Y. Tsui from Texas Instruments for supplying the Cu films.

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