The mechanical properties of freestanding electroplated Cu thin films

Y. XIANG; T. Y. TSUI; J. J. VLASSAK

doi:10.1557/jmr.2006.0195

The mechanical properties of freestanding electroplated Cu thin films

Y. XIANG, T. Y. TSUI, J. J. VLASSAK^*

^*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

102 Citations (Scopus)

Abstract

The plane-strain bulge test is used to investigate the mechanical behavior of freestanding electroplated Cu thin films as a function of film thickness and microstructure. The stiffness of the films increases slightly with decreasing film thickness because of changes in the crystallographic texture and the elastic anisotropy of Cu. Experimental stiffness values agree well with values derived from single-crystal elastic constants and the appropriate orientation distribution functions. No modulus deficit is observed. The yield stress of the films varies with film thickness and heat treatment as a result of changes in the grain size of the films. The yield stress follows typical Hall-Petch behavior if twins are counted as distinct grains, indicating that twin boundaries are effective barriers to dislocation motion. The Hall-Petch coefficient is in good agreement with values reported for bulk Cu. Film thickness and crystallographic texture have a negligible effect on the yield stress of the films.

Original language	English
Pages (from-to)	1607-1618
Number of pages	12
Journal	Journal of Materials Research
Volume	21
Issue number	6
Early online date	1 Jun 2006
DOIs	https://doi.org/10.1557/jmr.2006.0195
Publication status	Published - Jun 2006
Externally published	Yes

Bibliographical note

Acknowledgments: We thank M.T. Perez-Prado for assistance with XRD, W. Moberly Chan for help with the TEM work, and Y-S. Jun for use of the AFM. Helpful discussions with J.W. Hutchinson and F. Spaepen are gratefully acknowledged. This research was funded by the National Science Foundation (Grant No. DMR-0133559) and by the MRSEC at Harvard University.

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title = "The mechanical properties of freestanding electroplated Cu thin films",

abstract = "The plane-strain bulge test is used to investigate the mechanical behavior of freestanding electroplated Cu thin films as a function of film thickness and microstructure. The stiffness of the films increases slightly with decreasing film thickness because of changes in the crystallographic texture and the elastic anisotropy of Cu. Experimental stiffness values agree well with values derived from single-crystal elastic constants and the appropriate orientation distribution functions. No modulus deficit is observed. The yield stress of the films varies with film thickness and heat treatment as a result of changes in the grain size of the films. The yield stress follows typical Hall-Petch behavior if twins are counted as distinct grains, indicating that twin boundaries are effective barriers to dislocation motion. The Hall-Petch coefficient is in good agreement with values reported for bulk Cu. Film thickness and crystallographic texture have a negligible effect on the yield stress of the films.",

author = "Y. XIANG and TSUI, {T. Y.} and VLASSAK, {J. J.}",

note = "Acknowledgments: We thank M.T. Perez-Prado for assistance with XRD, W. Moberly Chan for help with the TEM work, and Y-S. Jun for use of the AFM. Helpful discussions with J.W. Hutchinson and F. Spaepen are gratefully acknowledged. This research was funded by the National Science Foundation (Grant No. DMR-0133559) and by the MRSEC at Harvard University.",

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AU - TSUI, T. Y.

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PY - 2006/6

Y1 - 2006/6

N2 - The plane-strain bulge test is used to investigate the mechanical behavior of freestanding electroplated Cu thin films as a function of film thickness and microstructure. The stiffness of the films increases slightly with decreasing film thickness because of changes in the crystallographic texture and the elastic anisotropy of Cu. Experimental stiffness values agree well with values derived from single-crystal elastic constants and the appropriate orientation distribution functions. No modulus deficit is observed. The yield stress of the films varies with film thickness and heat treatment as a result of changes in the grain size of the films. The yield stress follows typical Hall-Petch behavior if twins are counted as distinct grains, indicating that twin boundaries are effective barriers to dislocation motion. The Hall-Petch coefficient is in good agreement with values reported for bulk Cu. Film thickness and crystallographic texture have a negligible effect on the yield stress of the films.

AB - The plane-strain bulge test is used to investigate the mechanical behavior of freestanding electroplated Cu thin films as a function of film thickness and microstructure. The stiffness of the films increases slightly with decreasing film thickness because of changes in the crystallographic texture and the elastic anisotropy of Cu. Experimental stiffness values agree well with values derived from single-crystal elastic constants and the appropriate orientation distribution functions. No modulus deficit is observed. The yield stress of the films varies with film thickness and heat treatment as a result of changes in the grain size of the films. The yield stress follows typical Hall-Petch behavior if twins are counted as distinct grains, indicating that twin boundaries are effective barriers to dislocation motion. The Hall-Petch coefficient is in good agreement with values reported for bulk Cu. Film thickness and crystallographic texture have a negligible effect on the yield stress of the films.

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M3 - Journal Article (refereed)

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SP - 1607

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JO - Journal of Materials Research

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The mechanical properties of freestanding electroplated Cu thin films

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