Abstract
To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating that it can be a promising candidate for the TIM used for power electronics applications. In addition, we estimated the contact thermal resistance at the interface between the Sn-Bi solder and the Cu plate with the assistance of scanning acoustic microscopy. The experimental data showed that Sn-Bi solder paste could be a promising adhesive material used to attach power modules especially with a large size on the heat sink. ©2014 by ASME.
| Original language | English |
|---|---|
| Article number | 011012 |
| Number of pages | 5 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 136 |
| Issue number | 1 |
| Early online date | 18 Feb 2014 |
| DOIs | |
| Publication status | Published - Mar 2014 |
| Externally published | Yes |
Keywords
- laser flash
- scanning acoustic microscopy
- Sn-Bi solder paste
- thermal interface material
- thermal resistance