Abstract
To promote heat dissipation in power electronics, we investigated the thermal conduction performance of Sn-Bi solder paste between two Cu plates. We measured the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating that it can be a promising candidate for the TIM used for power electronics applications. In addition, we estimated the contact thermal resistance at the interface between the Sn-Bi solder and the Cu plate with the assistance of scanning acoustic microscopy. The experimental data showed that Sn-Bi solder paste could be a promising adhesive material used to attach power modules especially with a large size on the heat sink. ©2014 by ASME.
| Original language | English |
|---|---|
| Article number | 011012 |
| Number of pages | 5 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 136 |
| Issue number | 1 |
| Early online date | 18 Feb 2014 |
| DOIs | |
| Publication status | Published - Mar 2014 |
| Externally published | Yes |
Funding
This work was supported in part by the National Natural Science Foundation of China with the Grant No. 51102149, National Science and Technology Major Project of the Ministry of Science and Technology of China with the Grant Nos. 2011ZX02601 and 2009ZX02038, Tsinghua National Laboratory for Information Science and Technology (TNList) Cross-Discipline Foundation, and the Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry.
Keywords
- laser flash
- scanning acoustic microscopy
- Sn-Bi solder paste
- thermal interface material
- thermal resistance