Thermal resistance analysis of Sn-Bi solder paste used as thermal interface material for power electronics applications

Rui ZHANG, Jian CAI, Qian WANG, Jingwei LI*, Yang HU, Hongda DU, Liangliang LI*

*Corresponding author for this work

Research output: Journal Publications › Journal Article (refereed) › peer-review

36 Citations (Scopus)

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Engineering

Material Science