Thermoelectric and mechanical properties of ZnSb/SiC nanocomposites

Funing TSENG, Siyang LI, Chaofeng WU, Yu PAN, Liangliang LI*

*Corresponding author for this work

Research output: Journal PublicationsJournal Article (refereed)peer-review

26 Citations (Scopus)

Abstract

Intermetallic compound ZnSb is a promising thermoelectric (TE) material with the advantages of low toxicity, abundance, and low cost; however, the relatively low figure of merit ZT and the brittleness of ZnSb limit its applications in TE devices. In this study, ZnSb/SiC nanocomposites were synthesized in order to improve both the TE and mechanical properties of ZnSb. ZnSb-based nanocomposites with x vol% SiC nanoparticles (x = 0, 0.3, 0.5, and 0.7) were prepared by mechanical alloying and spark plasma sintering. The power factor of ZnSb/SiC nanocomposite with 0.3 vol% SiC is increased. The thermal conductivity of all ZnSb/SiC nanocomposites is decreased due to the increase of interface scattering for phonons. More importantly, the fracture toughness of the nanocomposites is enhanced due to the addition of SiC. The largest ZT value and fracture toughness are found in the sample with 0.7 vol% SiC. The maximum ZT value of 0.68 is obtained at 400 °C, which is 35 % higher than that of the reference sample without SiC. The largest fracture toughness is 0.64 MPa m1/2, which is 31 % larger than that of the reference sample. The experimental data demonstrate that ZnSb/SiC nanocomposites with simultaneous enhancement of TE and mechanical properties are favorable for practical TE applications.
Original languageEnglish
Pages (from-to)5271-5280
Number of pages10
JournalJournal of Materials Science
Volume51
Issue number11
Early online date18 Feb 2016
DOIs
Publication statusPublished - Jun 2016
Externally publishedYes

Funding

This work was supported by the National Natural Science Foundation of China (Grant No. 51572149), the National Basic Research Program of China (Grant No. 2013CB632504), and National High Technology Research and Development Program of China (Grant No. 2012AA051104).

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