Viscosity and thermal conductivity of alumina microball/epoxy composites

Hui YU; Liangliang LI; Longhao QI

doi:10.1109/ICEPT.2011.6066859

Viscosity and thermal conductivity of alumina microball/epoxy composites

Hui YU^*, Liangliang LI, Longhao QI

^*Corresponding author for this work

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

9 Citations (Scopus)

Abstract

Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al₂O₃) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al ₂O₃ microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al₂O₃ microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al₂O₃ microball content of 60 vol. %.

Original language	English
Title of host publication	ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Publisher	IEEE
Pages	387-390
Number of pages	4
ISBN (Print)	9781457717680
DOIs	https://doi.org/10.1109/ICEPT.2011.6066859
Publication status	Published - 2011
Externally published	Yes
Event	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China Duration: 8 Aug 2011 → 11 Aug 2011

Conference

Conference	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Country/Territory	China
City	Shanghai
Period	8/08/11 → 11/08/11

Keywords

alumina microballs
composite
thermalconductivity
viscosity

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10.1109/ICEPT.2011.6066859

Cite this

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title = "Viscosity and thermal conductivity of alumina microball/epoxy composites",

abstract = "Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al 2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.",

keywords = "alumina microballs, composite, thermalconductivity, viscosity",

author = "Hui YU and Liangliang LI and Longhao QI",

year = "2011",

doi = "10.1109/ICEPT.2011.6066859",

language = "English",

isbn = "9781457717680",

pages = "387--390",

booktitle = "ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

publisher = "IEEE",

note = "2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 ; Conference date: 08-08-2011 Through 11-08-2011",

}

YU, H, LI, L & QI, L 2011, Viscosity and thermal conductivity of alumina microball/epoxy composites. in ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066859, IEEE, pp. 387-390, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 8/08/11. https://doi.org/10.1109/ICEPT.2011.6066859

Viscosity and thermal conductivity of alumina microball/epoxy composites. / YU, Hui; LI, Liangliang; QI, Longhao.
ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, 2011. p. 387-390 6066859.

Research output: Book Chapters | Papers in Conference Proceedings › Conference paper (refereed) › Research › peer-review

TY - GEN

T1 - Viscosity and thermal conductivity of alumina microball/epoxy composites

AU - YU, Hui

AU - LI, Liangliang

AU - QI, Longhao

PY - 2011

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N2 - Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al 2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.

AB - Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al 2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.

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KW - composite

KW - thermalconductivity

KW - viscosity

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M3 - Conference paper (refereed)

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SN - 9781457717680

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BT - ICEPT-HDP 2011 Proceedings : 2011 International Conference on Electronic Packaging Technology and High Density Packaging

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Y2 - 8 August 2011 through 11 August 2011

ER -

Viscosity and thermal conductivity of alumina microball/epoxy composites

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Keywords

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